Used SPEEDFAM DSM 9B-5P-V #9166335 for sale

SPEEDFAM DSM 9B-5P-V is a state-of-the-art wafer grinding, lapping, and polishing equipment for semiconductors and other wafer products. Specifically designed for the next generation of semiconductor production operations, the system offers superior surface finish, improved yield, and higher throughput. DSM 9B-5P-V is made up of a series of grinding, lapping, and polishing operations that take place in a vacuum chamber. The grinding step uses diamond impregnated or cup wheels to grind both sides of the wafer in a precisely controlled environment, ensuring uniform surface finish. The lapping process then utilizes a precision generator module to deliver uniform lapping pressures and slow speed so that the target finish is achieved. Finally, the polishing step utilizes a liquid slurry of polishing abrasives ranging from 100 to 2700 grade to produce a mirror finish. SPEEDFAM DSM 9B-5P-V also comes equipped with a variety of features that enhance its operations. The unit's high speed drive and its advanced control technology allows for high speed processing up to 10,000 RPM with precision control. The machine also features remote SCADA monitoring capabilities that enable it to periodically report the current processing status. DSM 9B-5P-V is also capable of a wide range of safety, quality control and maintenance features. Its safety tool helps protect the machine and its operators by controlling access, motion and vibration, and for monitoring energy consumption. Quality control offerings include vision and laser systems for wafer detection and barcode-based part tracking as a preventative quality measure. Maintenance is simplified with sensors that monitor all of the moving parts, such as the grinding heads and slurry pumps. The asset also comes with a centralized lubrication model that allows for quick maintenance and servicing. In all, SPEEDFAM DSM 9B-5P-V is an industry leading equipment for wafer grinding, lapping, and polishing. With its numerous features, it offers superior surface finish capabilities, improved yield, and higher throughput. It is ideal for driving the next generation of semiconductor production.