Used SPEEDFAM DSM 9B-5P-V #9166337 for sale

SPEEDFAM DSM 9B-5P-V is a wafer grinding, lapping and polishing equipment designed to provide high accuracy grinding and polishing in one single machine. It is equipped with a feed table, two work table rotation stages, a close tolerance pin clamping system and an innovative unit of tools and fixtures. Using a combination of advanced grinding and polishing technologies, DSM 9B-5P-V can process wafers of various sizes and types with maximum accuracy and efficiency. SPEEDFAM DSM 9B-5P-V's feed table accommodates up to nine wafers and is designed to feed and position the wafers into the grinding and polishing stages. The feed table's low efficient friction drive minimizes wafer damage and provides gentle wafer handling. The two work table rotation stages enable grinding and polishing operations in two directions and ensure precise destination addressing. The wide range of processes is facilitated by cross-platform capability, which allows operations to run in single direction and bidirectional mode. The pin clamping machine makes it easy to attach single and multiple wafers in position and allows for easy changeover between single- to multiple-wafer applications. DSM 9B-5P-V also incorporates a proprietary cooling tool to dissipate heat generated during grinding and polishing operations and facilitate tight tolerances and precision surface finish on wafers. The asset is further supported by an innovative design, which facilitates quick setup, easy changeover, and short cycle times between operations. In addition, SPEEDFAM DSM 9B-5P-V is equipped with a quality control monitoring model that allows measurements of wafers' thickness and flatness in real-time. The equipment is fully integrated with the grinding and polishing operations and can be programmed to allow for process parameters adjustment upon request. In conclusion, DSM 9B-5P-V is a comprehensive wafer grinding, lapping and polishing system that provides high accuracy in a single machine, allowing wafers of various sizes and types to be processed with maximum efficiency. Utilizing innovative grinding and polishing technologies, a proprietary cooling unit a pin clamping machine, tight tolerances and precision surface finish on wafers is obtained. Finally, the tool is also equipped with a quality control monitoring asset and a user-friendly interface for easy and quick setup and operation.