Used SPEEDFAM DSM 9B-5P-V #9166339 for sale

SPEEDFAM DSM 9B-5P-V is an advanced wafer grinding, lapping and polishing equipment featuring dual processing capabilities for improved yield, cost efficiency, and cycle time. This system is specifically designed for machining silicon, gallium arsenide, germanium ceramics, and other substrates to create complex device features. This unit employs high-speed spinning disks to grind and lap the surfaces of silicon substrates with a high level of accuracy. Additionally, DSM 9B-5P-V includes a planetary polishing head to polish the substrate to the required surface finish. SPEEDFAM DSM 9B-5P-V machine utilizes a combination of two independent spindles to process up to two wafers at a time. This configuration reduces cycle time, and improves yield and cost efficiency when machining complex substrates. Each spindle utilizes an independently controlled spindle drive motor and a highly abrasion resistant spindle disk for efficient and precise grinding and lapping operations. The planetary polishing head is comprised of a highly controllable and adjustable pressure head, multiple planetary stages, and a floating end effector for increased polishing accuracy. DSM 9B-5P-V features a programmable controller and graphical user interface for simple and intuitive operation. This tool is designed with a pneumatically actuated shuttle loader that can accommodate wafer sizes up to 8", and a heavy-duty indexer for precision substrate placement. Additionally, this asset has onboard recipe storage and regenerative braking capabilities for efficient cycle times and increased safety. SPEEDFAM DSM 9B-5P-V is equipped with an ultra-efficient dust collection model that removes small particles during machining operations. This equipment also incorporates an industry-leading filtration system to maintain a safe and contaminant-free work environment. Furthermore, DSM 9B-5P-V is designed to comply with all applicable safety directives and emission standards, and includes a comprehensive suite of safety features. In conclusion, SPEEDFAM DSM 9B-5P-V is an advanced wafer grinding, lapping and polishing unit specifically designed to provide exceptional accuracy and performance while machining complex substrates. This machine incorporates dual spindles, a programmable controller and user interface, a pneumatically actuated shuttle loader, a dust collection tool, and various safety features for improved yield, cost-efficiency, and cycle time.