Used SPEEDFAM DSM 9B-5P-V #9166340 for sale

SPEEDFAM DSM 9B-5P-V is a wafer grinding, lapping, and polishing equipment designed for semiconductor applications. The machine is made with high precision and quality components to ensure reproducibility and consistency in processing wafers. The system features a 5-axis motion platform which moves along the X, Y, Z, A and B axes. This allows for precise and repeatable positioning of the grinding and polishing head with micron level accuracy. The platform also has an ergonomic clamp holder to securely hold and manipulate the wafer when lapping or polishing. The grinding, lapping and polishing heads are driven by powerful, high-speed motor-spindles. The spindles are speed regulated to prevent the heads from overworking the substrate and damaging the wafer. Special attachment fixtures are used to properly affix each type of tool to the head - diamond grinding wheels, oil-lubricated, air-cooled lapping foils, and polishing pads. DSM 9B-5P-V has a built-in automatic wafer feeding unit, which provides a secure mechanism to transport wafers between the machine and the operator or an external wafer handler. The automatic feeding machine also minimizes user contact when handling large quantities of wafers, reducing contamination. The tool provides an adjustable air vacuum asset with a pulse back flush design to remove any grinding or polishing debris produced during processing. The model also comes with an integrated spindle chill unit to accurately regulate the temperature of the grinding and lapping spindles. SPEEDFAM DSM 9B-5P-V is an advanced and efficient equipment for the grinding, lapping and polishing of semiconductor wafers. It is constructed with high precision and quality components, and features several components that make the process easier and safer such as the automatic wafer feeder, adjustable vacuum system, and integrated spindle chill unit.