Used SPEEDFAM DSM 9B-5P #9380940 for sale

SPEEDFAM DSM 9B-5P is a multi-purpose wafer grinding, lapping and polishing equipment. SPEEDFAM DSM systems employ a unique rotating spindle design to provide precise automated control over the abrasive grinding and polishing process. This highly advanced system is compact and allows integration with automatic loading systems, providing a robust and efficient solution for the multiple processing steps required to achieve the desired geometry and surface finish of the finished wafer. The 9B-5P unit offers a wide range of grinding, lapping and polishing capabilities. It is suitable for a variety of automated processes, including grinding, lapping, surface finishing, and polishing of wafers ranging in size from 0.3mm to 20mm. In addition, the machine is capable of adjusting the grinding spindle in the directions of both horizontal and vertical axes. The 9B-5P tool offers four different grinding techniques. These include trapezoidal grinding, which is used to produce straight edges on wafers. It also has a centreless grinding capability, which can be used to make both flat and curved wafers. The asset also comes equipped with a belt-driven lapping technique, which is used to generate both planar and concave surface topographies on wafers. Lastly, SPEEDFAM patented 5P polishing procedure is included in the model, and this polishing equipment is capable of producing exceptionally smooth surfaces on a wide variety of wafers. The 9B-5P system is capable of running up to 80 wafers per hour. This is equipped with automated conveyor-fed wet or dry grinding, lapping and polishing procedures which enable the user to customize the speed, pressure and time duration for each step. Additionally, a range of advanced sensors and diagnostic monitors are used to provide continuous feedback on the unit's performance. DSM 9B-5P machine is a versatile and reliable tool for automated production and cost-saving applications. It allows for quick and precise control over grinding, lapping and polishing processes to maximize product quality and minimize operator effort. Thanks to its speed, efficiency and wide range of features, the 9B-5P tool is ideal for a variety of complex wafer grinding, lapping, and polishing applications in the semiconductor and other advanced industries.