Used SPEEDFAM DSM 9B-5PV3MH #9165241 for sale

SPEEDFAM DSM 9B-5PV3MH is a high-performance wafer grinding, lapping, and polishing equipment. This system is capable of grinding and polishing up to four semiconductor wafers at one time. It utilizes a unique combination of grinding, lapping, and polishing processes to achieve superior results in semiconductor wafer grinding and polishing. The unit is equipped with a table-type chamber that can accommodate up to four wafers. A grinding and polishing heads are placed over the chamber, which are adjustable in height and position to allow for precise adjustment and grinding/polishing operations. These heads are equipped with custom designed high-performance grinding and polishing media. This media is specifically designed and configured to provide the best possible grinding and polishing results. DSM 9B-5PV3MH is equipped with programmable motion control systems that accurately and precisely control the positioning and speed of the grinding and polishing heads for optimized results. Additionally, the chamber is capable of maintaining a controlled environment with adjustable temperatures and humidity levels. This ensures that all wafers are subjected to the same temperature and humidity levels while being processed. Finally, SPEEDFAM DSM 9B-5PV3MH is equipped with a user-friendly control machine that allows for remote operation. A touch-screen display allows for easy and intuitive operation of the tool, and a range of graphical displays provide users with the necessary information to accurately monitor and adjust the process. Overall, DSM 9B-5PV3MH is an effective and high-performance wafer grinding, lapping, and polishing asset. Its combination of precise positioning, grinding/polishing media selection, and motion control systems provides users with the best possible grinding and polishing performance, while its easy-to-use control model ensures that even novice users can process wafers with ease.