Used SPEEDFAM DSM 9B-5SSG-42 #9073040 for sale

SPEEDFAM DSM 9B-5SSG-42 is a wafer grinding, lapping and polishing equipment designed for use in the semiconductor industry. This system is capable of precision machining of wafers up to a size of 5 mm in thickness. The unit is designed to accurately perform grinding, lapping, and polishing operations without damaging the wafer cutting edges and thin films. The machine is comprised of the following components: the instrument base, variable speed motor, variable frequency drive, abrasive belt, rubber grinding pads, lapping paste, and polishing pads. The instrument base is composed of a rigid steel frame, constructed with vibration-resistant components, and designed to minimize thermal expansion. A variable speed motor with a maximum speed of 4000 rpm and a frequency of 10 Hz is used to drive the abrasive belt. The variable frequency drive is used to control the speed and direction of the motor, and to provide computer-controlled operation. The abrasive belt is constructed of a flexible material and is designed to remove surplus material from the wafer without damaging it. Soft rubber grinding pads are used to further abrade the wafer surface and prepare it for polishing. A lapping paste is used to create a smooth surface finish and enhance the clarity of the surface. Finally, polishing pads are used to bring the wafer surface to a mirror finish. DSM 9B-5SSG-42 tool is capable of achieving a maximum surface flatness and smoothness of 5 and 2 micro-inches (µm) respectively. This asset is capable of completing the surface preparation process in a fraction of the time compared to manual alternatives. In addition, the computer-controlled operation ensures consistent results and the model can be easily calibrated to accommodate any changes in the wafer composition or process parameters. As such, SPEEDFAM DSM 9B-5SSG-42 is an ideal solution for high-precision wafer preparation in the semiconductor industry.