Used SPEEDFAM DSM 9B-5SSG #9199230 for sale

SPEEDFAM DSM 9B-5SSG is an advanced wafer grinding, lapping & polishing equipment designed to process high volume large wafer manufacturing. The unique precision touch screen interface offers versatile programming capabilities with the added benefit of a graphic PC-Based system design. Key features of this unit include a 500mm worktable with aluminum oxide or silicone carbide abrasive discs and an adjustable abrasive delivery unit. The machine features a dynamically balanced 1,750rpm spindle motor which provides precise, high-speed grinding while maintaining optimal performance. This permits higher performance lap operations at shorter processing times. The motor is controlled via a highly efficient power board that offers precision control over the motor's performance. Accurate control is provided thanks to the separate Front and Rear motor regulation. The integrated super-abrasive diamonds on the unit are specially designed to reduce the force needed to achieve required polishing results. This makes them highly effective in precision polishing applications. The integrated air bearings are designed to reduce the overall grinding time and improve surface finish of the wafer processing. The unit also features two programmable fixed-abrasive delivery systems, one for accelerated processing and one for a uniform finish. By attaching to the wafer's surface layer, the in-air delivery tool extends the wear life of the abrasive disk and provides a higher quality result. Furthermore, the unit is designed with a sound deadening hood asset and offers protection from noise and dust. This protection is further reinforced by an integrated exhaust model which collects chips and dust, providing a hygienic work environment. The equipment is capable of operating in both wet and dry grinding, lapping and polishing applications, thanks to the included water delivery system. Overall, DSM 9B-5SSG is an advanced, cost effective and user friendly unit which offers high precision and industry leading performance in wafer grinding, lapping and polishing applications. This machine provides a reliable solution to the challenges of high volume large wafer manufacturing.