Used SPEEDFAM DSM22B-6PV-V4MH #9273142 for sale

SPEEDFAM DSM22B-6PV-V4MH is a state-of-the-art wafer grinding, lapping & polishing (WGLP) equipment. It can accommodate up to a 6-inch diameter wafer and is ideal for pre- and post-processing for semiconductor material applications. The system consists of a vertical spindle motor, two counter rotating grinding discs, and two diamond platens that provide a variety of processes depending on the abrasive used and the platen material. Furthermore, the grinding disc speed and the vertical spindle motor speed can be separately controlled. To optimize the WGLP process, a water nozzle wets the grinding wheel and the wafer surface with water, while a vacuum nozzle sucks the dust generated by the grinding process for safe disposal. The unit has a reliable action force control, which ensures the stability of the grinding/ polishing force during the process. Additionally, the advanced control machine provides real-time operation control during the process, and a warning tool will alert the operator if any failure occurs. The asset is cost-effective and offers high precision surface processing. It is easy to operate and maintain, making it an ideal choice for those who need to grind, lap or polish wafers.