Used SPEEDFAM DSM22B-6PV-V4MH #9273143 for sale

ID: 9273143
Vintage: 2010
Polisher 2010 vintage.
SPEEDFAM DSM22B-6PV-V4MH is a wafer grinding, lapping and polishing equipment, designed to meet the needs of the most advanced semiconductor and photonic manufacturers. This system combines precise control of speed, temperature, pressures, vibration and material removal rate during the wafer grinding, lapping or polishing process. SPEEDFAM DSM 22 B 6 PV V 4 MH is engineered to ensure efficient and reliable homogeneous processing across all wafers, allowing for consistent results with every wafer in the batch. DSM22B-6PV-V4MH is constructed with six individually isolated processors, each with independent digital motors to accurately control the speed, pressure, and vibration of the processes. The outer body is made from a reinforced polymer construction to reduce vibrations and ensure longer machine lifetime, while the enclosed environment of this unit also helps to provide cleaner operation. The user-friendly touchscreen control panel is equipped with a unique software suite, allowing you to control the machine and monitor the processing parameters online. This feature enables the user to determine the optimal conditions for each wafer and recognize problems quickly, optimizing the process time. DSM 22 B 6 PV V 4 MH is capable of processing wafers of different substrate materials such as Si, SiO2, GaAs, InP and others. It is also equipped with a variety of blades and discs with varying characteristics, allowing for the flexibility of specifying the surface profile of the wafer. SPEEDFAM DSM22B-6PV-V4MH utilizes an active water cooling circulation tool to keep the asset cool during long processing runs. Additionally, this model features a ventilated housing that helps regulate airflow and reduce excess heat, ensuring that the wafer grinding, lapping and polishing process are faster and more uniform. SPEEDFAM DSM 22 B 6 PV V 4 MH is designed to meet the most demanding requirements in the semiconductor and photonics industries. This wafer grinding, lapping and polishing equipment ensures that wafers are processed with precision and consistency, allowing users to produce high-quality components in a cost-effective manner.
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