Used SPEEDFAM DSM9B-5L-III #9120349 for sale

SPEEDFAM DSM9B-5L-III is a state-of-the-art wafer grinding, lapping & polishing equipment. It provides a cost-effective and reliable way to finish intricate substrates with high-quality surface finish and low cost of ownership. The system includes a high-precision spindle, along with a variable-speed drive unit, giving the machine the capability to process wafers with different shapes, sizes, and thicknesses. The spindle head is adjustable in both vertical and horizontal directions, allowing users to adjust the position of the workpiece, thus ensuring perfect tool contact and even pressure distribution across the entire diameter of the wafer. The spindle can provide up to 100,000 RPM, allowing it to operate at high speeds with great precision and little noise. Additionally, DSM9B-5L-III comes with a highly sensitive, advanced feed-back control tool that can adjust the speed automatically, ensuring great uniformity throughout the entire process. The abrasive used for wafer grinding on SPEEDFAM DSM9B-5L-III is a special patented abrasive diamond material that is long-lasting and durable. It combines high, grinding forces with low, cutting heat to achieve an effective grinding, lapping, and polishing result. Moreover, the asset has the capability to lapping & polishing workpieces up to 4" in diameter, allowing it to process and finish some of the most intricate substrates. The built-in patented cooling model of the equipment utilizes special cooling channels to facilitate the cooling of the workpiece during the lapping & polishing process. The cooling process significantly reduces the operating temperatures of the machine, thereby preventing the wafers and the diamond abrasive from excessive heating, and protecting them from damage. Finally, DSM9B-5L-III is equipped with safety features, such as shock protection and a safety switch that prevent it from running without supervision, safeguarding the operator's safety as well as the machine's integrity. The system is also highly efficient and easy to maintain, with minimal spare parts and low maintenance costs. Overall, SPEEDFAM DSM9B-5L-III wafer grinding, lapping & polishing unit is an ideal choice for any laboratory looking for high precision and consistent results. Its patented technology provides an affordable and reliable way to finish intricate workpieces with great accuracy and significantly reduced operating costs.