Used SPEEDFAM DSM9B-5L-III #9143479 for sale

SPEEDFAM DSM9B-5L-III is an advanced wafer grinding, lapping and polishing equipment used for processing multiple wafers of different sizes and shapes. The system includes a double-sided lapping machine, grinding head, main table, diametrically adjustable grinding wheels and peristaltic pump. The lapping machine is equipped with two pre-programmed wheel pairs and uses a three-axis motion control unit to precisely control the flow of the process and ensure that the wafers are polished with uniformity and accuracy. The grinding head of this machine is adjustable to accommodate wafers of various sizes. The grinding head features a diamond tool holder for grinding a wide variety of materials, including diamond and glass polishing. The grinding tool holder is adjustable to maintain a consistent and exact radius for each wafer, allowing for precise and uniform grinding results. The main table of DSM9B-5L-III is adjustable with an easy-to-use lever, allowing for easy setup and adjustment of the lapping machine. The main table is large enough to accommodate multiple wafers at once. The tool is also equipped with an adjustable frequency drive to provide flexibility and adjustability to the lapping process. SPEEDFAM DSM9B-5L-III also features an optional automatic clean-up asset. The clean-up model is designed to reduce the time and effort needed for manual clean-up and facilitate quick and efficient operations. The equipment also includes a smart temperature control system that helps prevent overheating and damage to the wafers. DSM9B-5L-III is a highly precise, efficient and reliable wafer grinding, lapping and polishing unit. It offers excellent accuracy and flexibility, allowing it to be used for a wide range of applications. The machine uses the latest technology to deliver superior results, making it an ideal choice for semiconductor and other high-precision applications.