Used SPEEDFAM DSM9B-5L-III #9223162 for sale

SPEEDFAM DSM9B-5L-III
ID: 9223162
Vintage: 1991
Double side wafer lapping system Without wafer position correcting carrier Includes: Sizing apparatus Slurry tank unit Pump 1991 vintage.
SPEEDFAM DSM9B-5L-III is a state-of-the-art wafer grinding, lapping and polishing equipment. This versatile production-ready system is designed to maximize precision, productivity and cost-efficiency in the fabrication of semiconductors, MEMS and other microtechnology components. The unit provides high-precision grinding, lapping and polishing of wafers up to 300mm in diameter. DSM9B-5L-III is equipped with a double-bearing servo-controlled spindle to ensure maximum accuracy and repeatability during grinding, lapping, and polishing processes. A digital surface quality control machine ensures efficient and consistent surface finishing. The tool's programmable digital control asset with multi-channel touchscreen commands allows users to store, edit and monitor process parameters, allowing for greater flexibility and the ability to recall stored parameters for a wide range of wafer processing applications. The model features a fully enclosed, inert gas pressure-controlled chamber and safety interlocks for equipment monitoring, providing protection for operators and preventing contamination of produced surfaces. Additionally, the system offers the ability to run in automated and manual modes, with simultaneous processing of up to five wafers. SPEEDFAM DSM9B-5L-III has a robust tool magazine that is capable of storing and handling up to nine different grinding and polishing tools. This unit includes a variety of specialized grinding and polishing slurries, as well as a fast-track™ deburring machine to reduce cycle times. In addition, the tool incorporates a variety of options including defoaming pumps, nozzle schedulers, and filter-less drying units. DSM9B-5L-III provides outstanding reliability, precision, and repeatability for cost-effective, reliable production of semiconductors, MEMS components, computer chips and other microtechnology components. Highly precise and robust processes result in a consistent planar finish on wafers, enabling the production of high-quality components with a low deviation in form. Easy to operate and maintain, the asset is the ideal solution for reliable, cost-effective production of microelectronic components.
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