Used SPEEDFAM G-150 #9219009 for sale

SPEEDFAM G-150 is a multifunctional, high-precision wafer grinding, lapping, and polishing equipment. Designed to process high-value materials such as gallium arsenide (GaAs) substrates, as well as fused silica, silicon, quartz, and sapphire substrates used in the electronics industry, its precise polishing capabilities make it ideal for semiconductor, optical, and MEMS applications. The system is made up of two distinct units: a Grinder, and a Lapper/Polisher (LP). The Grinder uses diamond abrasives mounted in an expanding wheel mandrel to remove large surface layers from the substrate and produce a post-grinding parallelism tolerance of better than 0.001 mm. Backed by a high-accuracy linear slide unit and a high-smoothness spindle motor, the Grinder delivers consistent power and accuracy. Additionally, the Grinder's unique "wave-movement" keeps abrasives fresh throughout the grinding process, extending useable wheel life. The Lapper/Polisher is designed for lapping, polishing, and flattening large and small wafers. Components include a steel or aluminum table, a pair of vertical or horizontal lapping platens, and two lapping arms. The motorized lapping arms create a continuous movement of the platens to ensure a consistent, uniform lapping, polishing, or grinding motion. The steel platen arms carefully regulate the flow of diamond abrasion, which eliminates problems of pass-over and pass-under, and ultimately provides a higher degree of surface accuracy with intense flatness and uniformity. The machine is able to achieve surface finishes of <1Å Ra on GaAs and other specialty substrates. G-150 tool also features a pressure-regulating asset, which is used to precisely control the contact force between the lapping platen and the wafer. The model is controlled by a centralized touchscreen interface that allows the user to monitor and adjust operational data in real-time. Overall, SPEEDFAM G-150 provides accurate, reliable, and precise results for applications that require the highest levels of material processing precision. By delivering consistent surface flatness and uniformity, this equipment is a cost-effective choice for use in the electronics and semiconductor industries.