Used SPEEDFAM G-24BTAW #9220222 for sale

SPEEDFAM G-24BTAW is a wafer grinding, lapping and polishing equipment designed specifically for use in the semiconductor manufacturing industry. It offers an exceptionally fast, cost-saving method of completing precision grinding and lapping processes. The system features a temperature controlled working environment to prevent distortion during the finishing process. The unit is made of an enclosed grinding/lapping assembly. The assembly includes a rotary table that holds a grinding or lapping plate. A grinding or polishing tool is affixed to the table and operated at variable speeds. The unit also features a self-contained hydro-air machine for cleaning and cooling the grinding/lapping tool and work surface. G-24BTAW has a compact design that can easily integrate into production line layouts. It features a range of abrasives that can be selected for adjustment to the material being processed. The tool includes a removable grinding/lapping plate that enables the user to change plates quickly without interrupting the cycle. SPEEDFAM G-24BTAW provides high-accuracy finishing, with a repeat accuracy to the micron level. The choice of grinding, lapping and polishing cycles can be adjusted to suit each individual application. The cycle speed can be adjusted to further increase efficiency and accuracy. G-24BTAW has an aesthetic, ergonomic design that allows for straightforward maintenance and adjustable components. The unit comes equipped with a HMI (Human Machine Interface) that enables easy programming and data acquisition. The asset can be monitored from any PC on the factory floor. SPEEDFAM G-24BTAW is renowned for its reliable operation, robust structure, easy maintenance and high precision. It is a highly effective, reliable, and efficient wafer grinding, lapping and polishing model for today's demanding semiconductor manufacturing requirements.