Used SPEEDFAM G-32BTGW #9118185 for sale

SPEEDFAM G-32BTGW is a high-performance wafer grinding, lapping, and polishing equipment for producing precision surfaces on a wide variety of semiconductor wafers. This system is equipped with two independently controllable grinding stations, allowing for automated processing of both inner and outer surfaces of the wafer. The spindle and stages also provide variable speed control to maximize processing efficiency. The design enables very low levels of noise emission and vibration and produces results with high repeatability. G-32BTGW's fully automated wafer-processing operations are supported by a powerful DC motor drive unit and a high-precision stepping motor machine. Its stainless steel construction ensures a long service life and allows the machine to be operated in a clean room environment. The wafers are securely clamped to the grinding jig and are held tightly for consistent, accurate results. The tool can also be used to produce lapped and polished surfaces on wafers. Its CMP stage features a highly rigid, three-point bearing support design that reduces vibration while improving accuracy. The inclusion of four spindles enables the asset to accommodate multi-axis operations. It also features an integrated polishing pad portal that enables better uniformity and reproducibility. SPEEDFAM G-32BTGW includes an intuitive human-machine interface that simplifies setup and operation. Users can easily load and unload substrates and monitor the progress of the operations. Comprehensive operations statistics are also available, enabling efficient process development and control. Remote maintenance and support are also available. To ensure maximum safety, G-32BTGW is designed with comprehensive safety functions, such as protective covers, interlocks, and automatic emergency shut-off. With its reliable performance and effective safety measures, this model is an ideal solution for wafer fabrication and packaging.