Used SPEEDFAM G-32BTGW #9193195 for sale

SPEEDFAM G-32BTGW is a multi-functional wafer grinding, lapping, and polishing equipment designed for use in the semiconductor industry. Featuring both rotary and linear motion, the system is capable of processing a wide variety of materials such as silicon, sapphire, gallium arsenide, and glass, making it ideal for a wide range of applications. The unit utilizes a unique grinding, lapping, and polishing action. A dual spindle, double-grit attachment is used to deliver precise grinding forces, while a low-pressure air/abrasive mixture provides a smooth, even finish. This is a different approach than the single-grit approach of most popular grinding machines. The spindle and low-pressure air/abrasive mixture offer a higher degree of cutting precision, allowing for accurate and repeatable machining operations. G-32BTGW has a five-stage rotating table that is designed specifically to support wafer grinding, lapping, and polishing operations. Each stage is equipped with a low-friction, reversible, magnetic drive that is designed for speed and accuracy. The table can accommodate both two- and four-inch wafers, and the low distribution of heat helps reduce thermal shock. The machine's automated vacuum load station is designed for maximum precision and repeatability. The load station is equipped with radiation resistant, closed-loop controls that are designed to ensure repeatable volumes are achieved, even with varying viscosity materials. The optional high pressure air/abrasive nozzles can apply additional force to the surface of the material to achieve even smoother finishes. SPEEDFAM G-32BTGW also includes a set of adjustable glass process chucks. These chucks are designed to precisely hold and polish wafers and are compatible with 0.5mm to 3mm TTV and up to 120mm of wafer size. The chucks can be used to support dynamic wafer polishing operations and are equipped with a manual positioning tool to ensure accurate placement of the material during processing. Overall, G-32BTGW is a superior option for a wide range of wafer grinding, lapping, and polishing operations. Its advanced features and capabilities make it highly desirable in the semiconductor industry. With its precise cutting action, adjustable process chucks, and automated vacuum loading station, the asset offers both accuracy and repeatability for fast and precise machining operations.