Used SPEEDFAM G-32BTGW #9279643 for sale

SPEEDFAM G-32BTGW is a highly accurate wafer grinding, lapping, and polishing equipment used in the semiconductor industry for process control and ensuring uniform results. It is designed to perform precision grinding, lapping, and polishing of both silicon and compound semiconductor materials up to 8" (203.2 mm) in diameter. The system is capable of achieving a high level of accuracy, with a vibration level of less than 1µm (0.00004") and a roughness value (Ra) of 0.3µm (0.000012"). Additionally, the unit is capable of performing low force lapping and polishing, allowing for a greater surface uniformity and finer finishes. G-32BTGW is a fully automated machine, providing superior control and precision in the grinding, lapping, and polishing process. It features a powerful Siemens 828D CNC control tool, which can be configured to meet the specific requirements of the process. Furthermore, the asset is equipped with a Vision 6-axis robot, allowing for automated sample manipulation and positioning and reducing the need for manual intervention. SPEEDFAM G-32BTGW also features a fully automated drive model for both the grinding and lapping processes. The grinding equipment is equipped with a 2-axis servo motor, providing superior control for accurate grinding and a reduced production time. Additionally, the lapping system is equipped with a multiple arm eccentric drive, allowing for constant belt speed and superior uniformity. The unit also includes several safety features, including a safety sensor, protection devices, and warning alarms - all designed to prevent accidents and reduce the risk of injury to personnel. Overall, G-32BTGW is an advanced machine with excellent precision and accuracy for grinding, lapping, and polishing wafers. It is suitable for use in both production and research and development processes, making it a valuable tool in the semiconductor industry.