Used SPEEDFAM JND 16B-5P #9185076 for sale

SPEEDFAM JND 16B-5P wafer grinding, lapping and polishing equipment provides accurate, efficient and cost effective machining of high-precision parts for a variety of industries. This system utilizes a high-precision linear motor drive unit, incorporating five motorized axes for incredibly precise movement and positioning of the workpiece with micron-level accuracy. This machine is designed for the precision grinding, lapping and polishing of wafers, substrates, and other parts ranging from 100 to 300 mm in diameter. The tool starts with a 5-axis dynamic swivel and tilting mechanism, providing both planetary and rotary motion in order to effectively position the parts in front of the grinding / polishing tools. The motion range is programmable to meet different requirements of various workpieces and production processes. Next, the asset is equipped with an enclosed static pressure-feed grinding and lapping spindle, with programmable speed ranging from 100 to 3500 RPM, to allow consistent high-precision grinding and machining of the parts. The maximum grinding travel is 800 mm, and the spindle is capable of feeding up to 2 tons of force for heavy-duty grinding. The lapping and polishing process is carried out by the 5-polisher setup, offering specialized motions and speeds to ensure precision results. The polishing stones are capable of traveling up to 400 mm along the part surface for even and controlled polishing, with programmable speed for accurate surface finish. The polishing and lapping process is also equipped with automatic lubrication and a dust collection model, optimizing the process. In addition, the equipment features a tool-handling system for quick and easy part exchange, with lift-assist for reduced operator fatigue. The unit is also designed for low maintenance with intuitive user controls and a transparent housing providing clear line of sight to the process. Optional accessories like a focus microscope or laser alignment tool can be used to check for optimal performance. JND 16B-5P wafer grinding, lapping and polishing machine is incredibly reliable for high-precision machining, and allows for cost-effective production with fast turnaround times. With its precision, high power performance, and intuitive controls, this tool provides repeatable results for a range of parts and materials.