Used SPEEDFAM JND 16B-5P #9270038 for sale

SPEEDFAM JND 16B-5P wafer grinding, lapping and polishing equipment is an advanced, semi-automated wafer machining system designed for grinding, lapping and polishing of semiconductor wafers. The unit incorporates advanced control systems, motor controls, and monitoring systems so that the user is able to achieve tight geometrical tolerances and a high-quality finish on the wafers. The machine features a computerized control tool, which enables the user to program the machine for specific wafer sizes and wafer types, and to fine-tune performance parameters such as feed rate, platen speed and wafer pressure. This asset also allows for monitoring of parameters such as grinding pressure, grinding speed, feed rate, and the number of wafers processed. JND 16B-5P features a durable cast iron base, which is designed to be relatively low to the floor for efficient material handling and improved safety. The model is equipped with a pass-through-style grinding platen for improved wafer loading and unloading. The platen is adjustable, so that the wafer pressure, grinding pressure, and speed can be properly adjusted for the wafer material being processed. In addition, the equipment is equipped with a five-step grinding and lapping process, which is designed to clean and prepare the wafer before polishing. The first two steps involve pre-grinding and lapping, followed by a three-step polishing process to provide a high-quality finished wafer. During each step, the platen is kept in constant motion to reduce stress on the wafer surface and to provide a consistent finish. SPEEDFAM JND 16B-5P is capable of processing multiple wafers at the same time, up to a maximum capacity of 5 wafers per cycle. It is equipped with a robust dust collection system to ensure a clean working environment, and is designed to operate safely and quietly. The machine is also protected against overloads with a thermal limit switch, and is maintained according to manufacturer's specifications. Overall, JND 16B-5P is an advanced, semi-automated unit designed to optimize wafer grinding, lapping and polishing processes in high-precision environments. The machine provides the user with precise monitoring controls, allowing for precise machining of wafers.