Used SPEEDFAM JND 16B-5PV-3MH #9066799 for sale

SPEEDFAM JND 16B-5PV-3MH Wafer Grinding, Lapping & Polishing Equipment is an elite grinding, lapping and polishing system designed to meet the needs of the most demanding semiconductor fabrication applications. The unit features a platen size of 16" (41 cm), an unbalanced orifice of 5 mm, a vacuum table of 3 m/h, a drive power of 0.55 kW, and a net weight of 270 kg. It is designed to help manufacturers achieve the highest levels of precision, surface finish, and durability. The machine is composed of a Primary and Secondary Platen as well as a swivel Table which can be rotated and tilted for improved flexibility. The Primary Platen features a static polishing pad with 270 degrees of adjustable pressure, while the Secondary Platen features an independent adjustable polishing pad. Both Platen's are equipped with a heavy-duty linear bearing and motorized drive tool for added torque and power. The rotating and tilting Table can be used for enhanced flexibility when polishing large and/or multiple wafers. The asset also incorporates a powerful diamond slurry feed and dispensing model. The equipment is equipped with a built-in skid plate for transporting large wafers with ease. JND 16B-5PV-3MH Wafer Grinding, Lapping & Polishing System also incorporates a high-precision spindle motor for improved vibration dampening and significantly greater accuracy. SPEEDFAM JND 16B-5PV-3MH Wafer Grinding, Lapping & Polishing Unit is designed to produce components with a minimum Ra of 5nm. State-of-the-art vacuum technology allows the machine to reduce the amount of air bubbles present in the slurry, resulting in improved performance and an extended lifespan. The tool is also designed to accommodate a wide range of abrasives, making it ideal for a variety of grinding, lapidary and polishing applications. The Asset is backed by a warranty and training program to ensure the highest level of quality and reliability. With its precise tolerances and powerful drives, JND 16B-5PV-3MH Wafer Grinding, Lapping & Polishing Model is the perfect choice for the most demanding semiconductor fabrication applications.