Used SPEEDFAM JND 21B-5P-II #9133576 for sale

SPEEDFAM JND 21B-5P-II is a fully automated, multi-directional grinding, lapping and polishing equipment used to produce highly accurate, smooth subsurface surfaces on optical, semiconductor and opto-mechanical components. This system is designed to provide the highest precision finish without significant incremental cycle time. It can achieve a superior finish on wafers ranging from 2" to 8" in diameter. JND 21B-5P-II is equipped with a 5-axis motion unit featuring linear motion, rotational motion and indexing motion. This allows for rapid programming of programs for repeatable and consistent results. The grinding head is designed with a floating abrasive platen and shock-resistant cone cups to ensure that grinding and polishing is done evenly and accurately. It is also equipped with double plate mounted, self-compensating spindle drives to ensure a smooth and consistent finish. The polishing head of SPEEDFAM JND 21B-5P-II features an integrated liquid solution reservoir and heater to provide a controlled environment for polishing. The heater maintains a consistent temperature while the liquid is fed through the solution head to create a consistent polishing surface. The machine is equipped with a vision station that enables full wafer inspection and automated image analysis to ensure the highest finish quality. It also features an automatic grinding setting to ensure a uniform surface in the grinding process. The tool is also equipped with an advanced control asset with real-time process control and monitoring capabilities. The control model features an intuitive user interface, allowing the operator to quickly set up and monitor process parameters. JND 21B-5P-II is a reliable and efficient way to produce superior finish on wafers in a highly automated manner. With its high-precision grinding and polishing capabilities, it is a great choice for producing optical, semiconductor, and opto-mechanical components with smooth and accurate subsurface surfaces.