Used SPEEDFAM JND 28B-4P #9225430 for sale

SPEEDFAM JND 28B-4P is a wafer grinding, lapping and polishing equipment designed for use in the production of semiconductor wafers. The system is capable of producing high-precision, high-quality surfaces on a range of materials including silicon, gallium arsenide and other materials. The main components of the unit are the grinding wheel, the wafer-holding plate, and the rotating grinding wheel. The grinding wheel is configured so that when rotated in the proper direction, it will cut away material from the surface of the wafer. The wafer-holding plate ensures that the wafer is securely held in place during the grinding process. The grinding processes are controlled by an automated machine which measures the motion of the grinding wheel, as well as the interface between the wafer and the grinding wheel. The tool allows for precise control of the grinding process, guaranteeing that the wafer is machined to the desired specifications with minimal wastage of abrasive material. The grinding process is followed by the lapping process. This process employs a pad and rotating diamond disc which, when set to the desired specifications, create the desired surface profile and flatness on the wafer. This process is also automated and is typically designed to produce a specific surface texture which meets the requirements of the device that will be manufactured on the wafer. The final process is polishing, which deals with the surface roughness created during lapping. The polishing process involves the application of polishing compounds, pressure and heat to create a flawless surface. The polishing process is also automated and often uses a polish on one side of the wafer and then a polishing compound on the other side. JND 28B-4P is designed for use in the production of semiconductor wafers, ensuring that these are machined to correct dimensions and surface quality. The asset is capable of grinding, lapping, and polishing wafers in order to provide a high-precision, high-quality surface finish suitable for the manufacture of semiconductor devices.