Used SPEEDFAM JND 9B-5L-IV #293635664 for sale

SPEEDFAM JND 9B-5L-IV is a powerful and efficient wafer grinding, lapping and polishing equipment. It is equipped with a five-axis CNC operation, allowing for precise execution of all grinding, lapping, and polishing processes on small, intermediate, and large diameter wafers. The large working envelope of the system accommodates a wide range of process heads and tools, including grinding wheels, lapping disc holders, and polishing pad holders. This unit is ideal for both R&D and production environments, with the capacity to process wafer diameters ranging from 4-inch up to 12-inch. The machine features a high-speed master carriage for fast and accurate positioning of the head containing the grinding, lapping and polishing tools. The dual AB controlled rotary axes of the machine are designed to maximize the process parameters and accurately adjust the tool path. The easy-to-navigate software allows for the programming of the entire grinding, lapping and polishing process with maximum efficiency. The powerful motor of JND 9B-5L-IV is capable of driving the tool head with up to 120V AC and up to 5 HP, depending on the size of the wafer. SPEEDFAM JND 9B-5L-IV wafer grinding, lapping and polishing tool features an abrasion-proof material construction, ensuring durability and ensuring long-term reliability. The user-friendly controls make the asset easy to operate and maintain. The dual CCD cameras can be used to monitor the grinding and polishing process in real-time, also allowing for precise speed and certain distance measurements. The auto-switching function of the machine quickly and conveniently allows for a change between grinding, lapping and polishing processes. The machine also comes with additional safety features such as an electrical limit switch and an perimeter guard to protect the operator from hazardous contact with the machining head. The in-machine measurement model constantly checks the integrity of the workpiece. Meanwhile, the water filter equipment removes all pollutants from the coolant during the grinding and polishing process. Overall, JND 9B-5L-IV wafer grinding, lapping and polishing system offers a reliable and cost-effective solution for high-precision wafer processing.