Used SPEEDFAM JND 9B-5L #9256197 for sale

SPEEDFAM JND 9B-5L is a wafer grinding, lapping & polishing equipment designed for use in the semiconductor industry. It is capable of processing single-sided and double-sided wafers up to 6 inches in diameter and 0.5 mm thick. The machine is equipped with a 9 inch, single-spindle grinding head and 5 inch, lapping/polishing heads, resulting in a multi-solution platform. A user-friendly PC-controlled interface allows the user to control the grinding/lapping/polishing operations and is designed for easy data logging. The system is capable of achieving a uniform surface finish on all types of wafers, ranging from 10 to 80 Ra. The grinding process uses standard grinding wheels and polishing pads, and is suitable for both resin-bond and metal-bonded abrasives. The lapping procedure can be used for both mechanical- and chemical-mechanical polishing of the wafer surface. A high-precision air bearing spindle ensures repeatable lapping and polishing results, enabling the user to achieve a consistent and precise surface finish. JND 9B-5L is designed for the highest level of industrial safety and reliability in operation. It is equipped with an emergency stop switch, over-temperature safety switch, and a cooling fan that prevents overheating of the machine's components. The unit also features an in-process monitoring machine to ensure accuracy and consistency in the grinding, lapping, and polishing operations. The automatic spindle loading and unloading tool ensures fast and efficient processing of wafers up to 0.5 mm thick. SPEEDFAM JND 9B-5L is designed to provide the highest quality surface finishing results in a single pass and is ideal for customers who require a high surface finish on their wafers. Its user-friendly design ensures easy setup and data logging, while the optional process monitoring asset guarantees repeatable and consistent results. With its efficient operation and safety features, JND 9B-5L is an ideal choice for those looking for reliable and high-performance wafer grinding, lapping, and polishing.