Used SPEEDFAM JND 9B-5L #9256702 for sale

SPEEDFAM JND 9B-5L is a wafer grinding, lapping and polishing equipment designed to accommodate a variety of production applications. This system combines an extensive array of advanced features that make it the perfect choice for users looking for high-quality, precision control. The main components of the unit include a servo drive motor, precision spindle, and PLC console. The motor is capable of providing a maximum speed of 60000 revolutions per minute (RPM) and is powered by a servo drive. This provides a consistent level of torque and regulated speed control throughout the grinding and polishing process. The spindle is an integral component of the machine and allows for the adjustment of start and stop points, speed, and feed rate. It also helps ensure a gratifying sample surface finish. The spindle is comprised of high-alloy steel spindles, a dual-drive tool, and a triple wheel set. The triple wheel set is constructed of diamond abrasives, which is ideal for grinding, lapping and polishing wafers. The PLC console is located on the front of the asset and acts as an operator interface. It features a wide array of parameter setting options as they relate to the grinding and polishing process. Users are able to select and adjust parameters such as feed rate, speed, wheel position, number of passes, water flow, cycle time, duration, and number of abrasive discs. JND 9B-5L is suitable for a variety of production applications such as thin wafer grinding and polishing, super-polishing for components, and the pre-lapping of multi-conductor wafers. This model is well-suited for handling production batches of two to five component wafers. Thanks to its reliable features, this equipment ensures processing accuracy and enhanced production efficiency while providing a consistently gratifying sample surface finish quality. The system also features an impressive CCD image to help users locate and check the exact size, shape, and position of the wafer sample.