Used SPEEDFAM JND 9B-5P-III #9166278 for sale

SPEEDFAM JND 9B-5P-III is a wafer grinding, lapping and polishing equipment designed to provide customers with a precision machined and highly repeatable product. This system provides high-precision processes for medium-to-large size wafers with a diameter of up to 5.5 inches. JND 9B-5P-III utilizes an XY-Axis configuration, allowing for both a multi-axis scanning and a high-speed single-point grinding, lapping, and polishing operation. SPEEDFAM JND 9B-5P-III utilizes a single-head design with multiple grinding, lapping, and polishing stages. All stages take place in the same chamber and, for each wafer processing, the machine utilizes multiple grinders, lappers, and polishers to ensure optimal process results and uniform results. The multiple stages of processing allow for a variety of calibration steps such that both a smooth surface finish and flatness can be achieved in the wafer surface. JND 9B-5P-III utilizes a variable speed polisher, enabling customers to adjust process speeds to achieve different process results. In addition to the capability to vary the process speed, the machine also utilizes a multi-start lapping process, allowing for a more accurate discovery of the desired flatness and surface finish. SPEEDFAM JND 9B-5P-III also utilizes a sophisticated wafer positioning unit, allowing for rapid and repeatable positioning of the wafer throughout the process. This machine utilizes linear slides for the positioning, which combined with the dual-axis scan capability allow for consistent precision machining of each wafer. JND 9B-5P-III tool is designed to provide customers with an highly repeatable and precise process to achieve desired surface finish and flatness. The asset is capable of processing wafers up to 5.5 inches in diameter and can utilize single-head or multi-head configurations to provide calibration and process consistency. With the adjustable polishing speed, multi-start lapping, and the accurate positioning throughout the process, this model is capable of providing reliable wafer processing results.