Used SPEEDFAM JND 9B-5P-III #9166283 for sale

SPEEDFAM JND 9B-5P-III is a state of the art wafer grinding, lapping and polishing equipment. This system is ideal for a variety of semiconductor processes including lapping, polishing, grinding and CMP (chemical mechanical polishing). The 9B-5P-III is a highly automated unit, featuring a touch panel programmable operating machine and user-friendly interfaces. The tool offers a wide range of uniform finishes and refractive properties, producing parts that have consistent and superior overall appearance and performance. The 9B-5P-III grinding and lapping machine is a three-axis, high-precision asset with a fixed abrasive head and an independently controlled axis. It has an advanced air bearing model and an active counterbalance equipment, which enables the machine to maintain high precision results and a consistent, uniform finish. The system also features a unique bell-shaped rotary table with an integrated slurry delivery unit, and a fully automated wafer holder with an indexing feature for reduced cycle time. The 9B-5P-III has the capacity to process up to eight parts simultaneously, with a maximum wafer thickness of 0.387 inches (0.3 millimeters). The machine is capable of grinding and polishing to a minimum finish of 5-7 Angstroms, with a polishing ratio of 1:4. The 9B-5P-III is a robust and resilient machine, using advanced machine and lubricant testing techniques to ensure optimal and repeatable control of lapping and polishing processes. The high level of automation supported by this tool reduces human error, and is designed to increase throughput, consistency, accuracy and cost-efficiency. This ensures that high-precision parts are consistently delivered with optimal accuracy, uniformity and surface finish. To maintain optimal performance and reduce maintenance and operational costs, this asset ships with a range of accessories and replacement parts, including diamond abrasive solutions and valves. Additionally, an environmental filter kit is available for use in reducing airborne particles. Overall, JND 9B-5P-III is an ideal wafer grinding, lapping and polishing model, with the capacity to provide uniform finishes and refractive properties with superior overall appearance and performance. This equipment can handle production volumes of up to eight parts simultaneously and produces high-quality parts with minimized human error. With advanced automation capabilities, reduced maintenance and accessories and replacement parts, the 9B-5P-III is the perfect choice for processes requiring accurate, efficient and cost-effective lapping and polishing. This system is designed to ensure excellent results and complete customer satisfaction.