Used SPEEDFAM JND 9B-5P-III #9166312 for sale

SPEEDFAM JND 9B-5P-III is a high-end wafer grinding, lapping, and polishing equipment designed for semiconductor production. It is capable of handling a variety of different wafer sizes and shapes, including 3-5 inch round wafers, square wafers, and octagonal wafers, and is equipped with state-of-the-art technologies to ensure consistent results. The 9B-5P-III is designed to provide a comprehensive solution for wafer grinding, lapping and polishing. The system features three independent grinding axes each capable of parallel motion along X, Y, and Z axes, giving it access to unique curves and contours. It also features an automatic diamond lapping and polishing wheel that provides repeatable results and reduces the size of the grinding wheel. This is crucial for precision wafer grinding and lapping. The unit also includes an integrated software, PLC (Programmable Logic Controller) controller and a range of data gathering and analysis options. This allows for the use of specialized parameters such as cutting speed, surface temperature, wheel pressure, and grind rate. These parameters can be monitored via computer and adjusted if necessary, allowing for extremely precise results. JND 9B-5P-III is also designed for low maintenance, minimal downtime, and a long service life. It features a durable construction with components made of the highest grade materials, and a corrosion-resistant stainless-steel housing. It is equipped with reliable sensors for monitoring and controlling the grinding and lapping process, ensuring consistent results from the start to the finish. In conclusion, SPEEDFAM JND 9B-5P-III is a wafer grinding, lapping and polishing machine that provides high-precision results. It is easy to use and maintain, and provides flexible control over the grinding process to ensure consistently reliable results. It is the perfect choice for any semiconductor production facility looking for a reliable and efficient grinding, lapping and polishing solution.