Used SPEEDFAM JND 9B-5P-IV #9199074 for sale

SPEEDFAM JND 9B-5P-IV wafer grinding, lapping & polishing equipment is a high-precision, automated system that is designed for the surface preparation of wafers. It is designed for grinding, lapping and polishing a wide range of materials, including semi-conductor materials, optics, MEMS, ceramics, and many more engineering materials for the semiconductor and optoelectronics industries. JND 9B-5P-IV machine consists of a precision mechanical unit, combined with a process control and air bearing spindles to ensure high accuracy. The wafer grinding process involves the use of fine diamond particles, suspended in a liquid, to mechanically grind the surface and profile of the target material. The liquid is used as a carrier for the grinding media and an abrasive, enabling the component to be worked to the desired shape. With the use of high efficiency spindles, the grinding process can be carried out at very high speeds for high uniformity, surface finish and precise profile. The lapping process involves the use of a diamond-rich suspension to polish the surface of the target material. It features high forces and very low speeds, which mean a thinner, more uniform and smoother polished surface is achieved with less wear on the material. The lapping process is beneficial for reducing surface roughness, achieving greater optical resolution and improving surface finish. The polishing process is conducted using abrasive and buffing wheels, which make use of abrasive and buffing compound to finish the product. The process is useful for producing highly reflective surfaces, and can achieve an extremely high level of finish. SPEEDFAM JND 9B-5P-IV can also be used for cleaning wafers. An integrated cleaning machine can be used to remove debris, dust and other contaminants that may be present. This cleaning tool is designed to meet the highest standards in the industry, and can be adjusted for different types of cleaning applications. Overall, JND 9B-5P-IV offers excellent performance and reliability for wafer grinding, lapping and polishing. Its combination of mechanical precision, process control and air bearing spindles ensures high precision and consistency, along with a high level of throughput. It can be used for a variety of applications, including the surface preparation of wafers, as well as other materials used in the semiconductor and optoelectronics industry.