Used SPEEDFAM JND 9B-5P-IV #9199075 for sale

SPEEDFAM JND 9B-5P-IV Wafer Grinding, Lapping and Polishing Equipment is designed to provide an effective and efficient solution for the precision production grinding and lapping of semiconductor wafers. The system comprises of a modular design, which allows for the flexibility to customize each wafer grinding station according to the customer's specific requirements. Each grinding station is equipped with an individual control unit, allowing for independent process settings and parameters across the machine. With its heavy-duty design, the tool is capable of accommodating large-scale production runs, while ensuring precise machining quality and stability. The asset is equipped with a three-zone grinding chamber, allowing for a wide range of grinding and lapping operations. The first zone provides coarse and fine grinding with adjustable speed and adjustable pressure. The second zone contains precision lapping for ultra-fine vertical wafer surfaces, while the third zone contains automated polishing processes. Each stage is equipped with a high- precision linear axis servo model providing accurate, repeatable movements and controlled work rates for improved machining quality and precision. The grinding and lapping operations are powered by a spindle motor that is temperature controlled, providing consistent grinding performance and minimize component temperature. The equipment can also be utilized as a complete grinding and lapping system, or as individual mechanical chambers, all of which can be interchanged quickly and easily with other chambers such as polishing, etching, and milling. The unit also features a multiple temperature-controlled chamber capable of producing exceptionally flat, vibration-free surfaces, even on small wafers. The machine is designed to be easy to operate, and includes a range of safety features to ensure the safe and secure operation of the tool. The asset also includes an automatic grinding roller model providing a consistent grinding rate and avoiding the inconsistency of hand-grinding. In addition to providing superior grinding, lapping, and polishing, JND 9B-5P-IV can also be used in a variety of etching processes for the finer details and features of the wafers. The equipment offers a wide range of operating parameters and customizable settings, so that you can achieve the highest precision for a wide variety of production tasks. SPEEDFAM JND 9B-5P-IV Wafer Grinding, Lapping and Polishing System is the perfect solution for those looking for precise, high-speed production and optimum safety. With its superior design, flexibility, and safety features, this unit offers a cost-effective and efficient solution for the production grinding, lapping, and polishing of semiconductor wafers.