Used SPEEDFAM JND 9B-5P-IV #9296540 for sale

SPEEDFAM JND 9B-5P-IV is a state-of-the-art wafer grinding, lapping, and polishing system designed for precision and excellence in the semiconductor industry. It combines a three-stage process for grinding, lapping, and polishing wafers, along with upconversion technology, resulting in a superior finished product. The grinding stage begins with diamond-impregnated grinding wheels. An amorphous diamond layer is applied to the surface of the grinding wheel to improve surface contact, reduce grinding temperatures, and minimize the amount of dust produced. The diamond layer is abrasive and efficiently grinds the wafer to the desired dimensions. Next, the lapping stage takes place. A unique lapping wheel is employed with specially designed grinding segments that produce the optimal surface finish and highest throughputs. This wheel employs an upconversion method to rapidly grind the wafer surface, providing a repeatable surface finish down to the sub-micron level. Finally, the polishing stage provides the wafers with their ultimate finish. An advanced diamond-impregnated polishing pad combined with ultra-high-pressure and low-velocity polishing and conditioning techniques deliver the precise, repeatable finish required for the highest quality wafers. JND 9B-5P-IV is an ideal choice for the microelectronics industry as it offers a superior level of accuracy, performance, and quality control. It provides a uniform, consistent finish on wafers while maintaining the highest throughput rate. With its advanced diamond-impregnated grinding wheels and upconversion lapping technology, SPEEDFAM JND 9B-5P-IV sets a new standard for wafer grinding, lapping, and polishing systems.