Used SPEEDFAM JND 9B-5P #9166272 for sale

SPEEDFAM JND 9B-5P is a precision wafer grinding, lapping and polishing equipment designed to provide outstanding performance, accuracy, and versatility in all polishing and lapping operations. This system uses two grinding/ polishing heads to rapidly grind and polish large wafers up to 6 by 3 inches. The two-head polishing unit is designed for automatic wafer loading and unloading, eliminating the need for manual selection and loading. The machine can be used for grinding, lapping and polishing operations on different kinds of substrates. The tool features a user-friendly 9" touch-screen controller, making it easy to program and operate. The asset's backgrinding head uses two precision grinding wheels to accurately grind the backside of the wafers. The model's polishing head is capable of buffing and polishing wafers; with the standard grinding wheel, polishing can be done with diamond abrasives or conventional abrasives. The equipment's constant speed controller adjusts for different substrate types and pre-programmed polishing parameters, ensuring a consistent quality. The system is designed to pre-lap wafers for further processing, and also provide them with a surface for accurate wafer handling. This unit also has a magnetic disk support mechanism, enabling the use of multiple carriers and disks. JND 9B-5P also includes an integrated polishing chamber, which allows wafers to be automatically polished without the need for any external clamping apparatus, saving time and money on manual clamping operations. The vertically adjustable magnetic chucker further increases the capabilities and flexibility of the machine. With the chucker, not only can the wafer be lapped, but also can be directly polished and easily replaced after the process is finished. The tool also features automatic wafer centering, ensuring an even distribution of the raw material for consistent polishing/lapping parameters. Additionally, the asset provides an integrated cooling model, helping to keep the temperature of the polishing chamber and wafer consistent for optimal results. Overall, SPEEDFAM JND 9B-5P is a precision wafer grinding, lapping and polishing equipment designed for continuous, automated operation. Its two-head configuration allows for precise polishing in one pass, while its integrated polishing chamber, cooling system, and magnetic chucker provide ultimate control and versatility. With its user-friendly interface, extensive process capabilities, and adjustable parameters, JND 9B-5P is well-suited for the advanced and demanding requirements of the most exacting applications.