Used SPEEDFAM JND 9B-5SSG-IV #9256705 for sale

ID: 9256705
Vintage: 1991
Double sided lapping machine Surface plate diameter: φ650 Does not include surface plate 1991 vintage.
SPEEDFAM JND 9B-5SSG-IV is a wafer grinding, lapping and polishing equipment used to manufacture high-quality integrated circuits. This system features an automated loading unit for easy setup, two user-friendly controller units, and advanced grinding technology. The unit starts with the automated loading unit, which is designed to quickly and accurately position wafers for processing. The loading unit supports both 5" and 6" wafers, which are transferred between the loader and the grinding and polishing unit via either manual or automated grinding spindles. The two controller units are based on a Windows paradigm and have the ability to store up to 100 different grinding/polishing processes. This feature allows the user to quickly switch between different processes and make adjustments on the fly. Additionally, a number of security protocols can be enabled to prevent unauthorized access to the stored processes. The machine features advanced grinding technology, including an automated double-disc design that provides uniform grinding contact at a high rate of speed. The design also helps reduce particle contamination and does not require special lubricants, making it ideal for lower-tolerance IC production. Additionally, the tool is equipped with special vibration-reduction mechanisms that help reduce the chances of mechanical damage to the IC chips being processed. The asset offers very precise grinding and polishing capabilities thanks to its high accuracy spindles, which can reach speeds of up to 7,000rpm. Furthermore, the machine is fitted with multiple polishing pads that can be configured to accommodate different IC design needs and support a very high throughput rate. JND 9B-5SSG-IV is designed for both manual and automated operations and is capable of producing high-quality integrated circuits in short time frames. The model offers improved accuracy, resilience, and run-time efficiency, making it a reliable and cost-effective solution for industrial-grade integrated circuit manufacturing.
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