Used SPEEDFAM JND 9B-5SSG-IV #9267138 for sale

SPEEDFAM JND 9B-5SSG-IV is a state-of-the-art wafer grinding, lapping, and polishing equipment designed for the advanced fabrication of today's most demanding integrated circuits. The system offers ultra-precise grinding, lapping, and polishing performance for the most complex integrated circuits, including 45 and 90-degree edges on silicon substrates and ICs up to 12" (300 mm) in size. The unit utilizes a fixed-head design featuring multiple heads that operate in unison to ensure low-tolerance surface finishes of <0.1 micron. The machine also features advanced pressure-control technology that ensures the best results possible, regardless of the substrate or integrated circuit material. The tool uses diamond tools to achieve high-precision lapping and polishing, with a choice of multiple types of diamond tool consumables available for optimal surface finishes. The diamond tools can be used for a variety of wafer grinding, lapping, and polishing processes, including roughing, primary, and secondary lapping, and abrasive polishing. The wafer grinding, lapping, and polishing asset is also equipped with advanced computer-controlled automated systems that enable automatic speed and pressure control. Along with a full suite of safety features, including an integrated emergency stop button, this ensures safe and reliable operation. The model's small footprint and modern design make it ideal for use with cleanroom layouts and processes. Its intelligent design also ensures minimum cross contamination between wafers and recirculation of process fluids. Its user-friendly, intuitive Human Machine Interface (HMI) and flexible control software provide easy operation, recipe control, and full SPC/SQC data logging/analysis functions that can be used to produce reproducible results. To top it off, this wafer grinding, lapping, and polishing equipment is backed by a comprehensive 3-year parts and labor warranty for unbeatable peace of mind.