Used SPEEDFAM JND 9B-5SSG-IV #9308054 for sale

SPEEDFAM JND 9B-5SSG-IV wafer grinding, lapping and polishing equipment is a fully automated machine offering superior performance and high accuracy. This machine is designed to grind and lap wafers faster and with greater precision than ever before, as well as providing a fully automated and repeatable process for securing surfaces of wafers to their exact specifications. The machine consists of an adjustable arm system, a stationary processing area, and an environmental chamber. The adjustable arm unit is comprised of five 5-axis electric servo motors and is capable of readjusting the wafers to different heights, angles, and shapes. This renders any potential damage to the wafer surface extremely unlikely and allows for accurate grinding and lapping of the wafer surface. The stationary processing area consists of two separate stations, which can process wafers in two stages (grinding and lapping). This double processing eliminates the need for manual handling, thus making the process more efficient and precise. The machine is also fitted with advanced cooling systems, which regulate the temperature of the wafer surface to prevent thermal damage and improve grinding and lapping accuracy. To ensure the highest quality of the wafer surface surface, an environmental chamber is also provided. This chamber can provide a sealed and controlled environment for the wafer processing. The environmental chamber helps to prevent contamination from dust and other airborne particles, as well as preventing the wafer surface from scorching or oxidation due to the intense heat generated during the process. JND 9B-5SSG-IV wafer grinding, lapping and polishing tool is customizable and can be adjusted to fit customers' exact requirements to ensure the most precise and accurate results. This versatile and highly efficient machine offers users a reliable and high-performance solution, increasing efficiency and accuracy of wafer processing and delivering superior results.