Used SPEEDFAM JND 9B-640-II #9166285 for sale

SPEEDFAM JND 9B-640-II is a state-of-the-art wafer grinding, lapping and polishing system. It is suitable for grinding and polishing large volumes of substrates up to 6" in diameter, such as patterned sapphire, natural sapphire, glass and many other materials. The unit measures 8' x 10', has a weight of approximately 4500 lbs, and is ruggedly fabricated using high-grade materials for a long life of precise and reliable performance. The process starts with a coarse grinding wheel to shape the surface of the substrate, followed by a precision grinding wheel for precise and uniform lapping. The lapping wheel is then used for a precise and fine finish polish. After the polish, the selected grinding wheel is then used to achieve a smooth and flat surface. The grinding and lapping processes are done at high speeds consistently and accurately, while maintaining a precise surface finish and precise dimensional control. JND 9B-640-II features a host of enhancements such as the ability to process a wide range of substrates, superior grinding and polishing speed and a high power output control. The advanced grinding and polishing process offers increased yield, improved safety and enhanced surface finishes compared to manual grinding and polishing. Furthermore, the system can be easily integrated into most semiconductor production lines, allowing for fast and efficient processing between passes. The machine also features a removable grinding & lapping arm and a vibration isolator to reduce vibration and help maintain consistent speed and abrasive force. SPEEDFAM JND 9B-640-II also comes with a dust cover and a washable enclosure to contain all process waste, while providing a soundproof environment to improve operator safety. In summary, JND 9B-640-II is a robust, feature-rich and reliable solution for grinding, lapping and polishing large volumes of substrates. The advanced processing capabilities and superior quality of finished products make it a highly sought-after solution for many semiconductor laboratories and manufacturers. This system is an invaluable tool for achieving precise and accurate blade, wafer, and flat surface finishes with ease.