Used SPEEDFAM / PETER WOLTERS 32 BGW #293800527 for sale
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SPEEDFAM / PETER WOLTERS 32 BGW is an advanced wafer grinding, lapping & polishing equipment. It is a double side, multi-head lapping/polishing machine for the production of flat, plane parallel and/or locally specified surfaces. The system is designed to provide superior surface finishing for the production of ultra-flat (2um level) and high precision (>1um) semiconductor wafers. The unit features an engineered design that utilizes a combination of superior mechanical and technological features. The versatile lapping and polishing head is designed to suit a variety of applications and specifications for larger wafer diameters. This includes wafer lapping and polishing operations, beveling, thick polishing and post-processing, as well as planarization and rough polishing. SPEEDFAM 32 BGW machine also employs advanced digital controls and programming capabilities. Programmable outputs and parameters such as machine cycle time, number of steps per cycle, speed adjustment, and horizontal/vertical lapping can all be set with the user-friendly interface. PETER WOLTERS 32 BGW comes equipped with a unique slide set-up mechanism, allowing quick and precise adjustment of lapping and polishing plates. This tool also includes a recipe management asset, which stores and manages recipes and helps in optimizing process parameters. The model is also capable of printing process results and maintaining statistical process control. 32 BGW also includes a wafer handling device which is used to accurately position the wafer on the slides. The equipment is capable of handling wafer sizes up to 450 mm and it has a wafer diameter range of 2mm up to 10mm. A fully programmable rotary feeder is also included for detailed pitch control. Overall, SPEEDFAM / PETER WOLTERS 32 BGW system is an optimized wafer grinding, lapping and polishing solution designed to meet the stringent requirements of the semiconductor industry. The advanced features, digital controls and recipe management unit enable the machine to deliver superior surfaces with repeatable process results.
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