Used SPEEDFAM / PETER WOLTERS 32 BGW #9194313 for sale

SPEEDFAM / PETER WOLTERS 32 BGW is a highly reliable, wafer grinding, lapping and polishing equipment, designed for high precision and repeatability. It is capable of grinding, lapping and polishing silicon wafers with a range of sizes up to 300 mm in diameter. This system stands out for its sheer power and accuracy is what makes it ideal for a variety of applications in the semiconductor industry. The device is composed of a main spindle unit fitted with a precision plane driving mechanism that moves whole wafers along X and Y axes, and a higher precision motor that rotates each wafer, allowing precise circular motion. Two separate spindles placed on the device's upper plate provide a further range of motion, allowing grinding, lapping and polishing. Both the spindle units can be adjusted to set different speeds, with a total range of 0-2500 rpm. Adjustment is facilitated by a convenient cogwheel unit and a central knob, allowing access to a wide range of settings. The machine also features variable-speed drive and rotation technology which rounds out the offering. This consists of a frequency converter that controls the speed of the main spindle's rotation to maintain the highest-possible performance. Furthermore, the polishing spindle is also equipped with an automatic voltage regulator, enabling a steady output of energy for consistent, long-term usage. The tool uses a state-of-the-art grindstone, which maximizes both grinding efficiency and grindstone lifespan, helping preserve resources and ensuring high-precision processing at all times. Additionally, for minimal loss of time and effort, its construction facilitates easy installation and short set-up times. Lastly, a range of safety features and interlocking mechanisms provide additional protection from potential dangers and ensures that the asset is always operated in accordance with standard safety regulations. In sum, SPEEDFAM 32 BGW is a powerful, reliable, high-precision wafer grinding, lapping and polishing model, designed to facilitate complex, large-scale applications in the semiconductor industry. It stands apart for its flexibility, accuracy and durability, as well as its range of safety features, allowing customers to use the device with confidence.