Used SPEEDFAM / PETER WOLTERS 32 BTAW #9286177 for sale

SPEEDFAM / PETER WOLTERS 32 BTAW is a multifunctional wafer grinding, lapping and polishing equipment designed for the production of thin wafers and substrates. The system is composed of a grinding/pitch polishing unit for different peripheries, lapping (process that uses abrasive paper sheets to cut away material until smooth surface finish is achieved) and diamond lapping (a combination of lapping and polishing methods) for high quality surface finish, and polishing (for achieving a mirror-like finish on the polished wafers). It also features an integrated substrate holder for uniform processing. The unit offers a wide range of grindings, lapping and polishing strategies from coarse polishing to the most precise mirror-like finish. The wafer grinding and lapping process involves removing a thin layer of material from the wafer. A pitch plate is used to transfer a mechanically vibratory motion to the wafer while abrasive material is use to remove material and create the desired surface profile. The lapping and polishing stage is done with a slurry composed of material and diamond polishing abrasives. The lapping process follows a series of steps which have to be repeated with gradually increasing finesse. The last step is the polishing step which smoothes out the polished surface to a mirror-like finish. SPEEDFAM 32 BTAW machine is designed to be able to produce thin wafers with high accuracy and reproducibility. It can achieve accurate size control by using the integrated laser tool that detects the dimensions of the wafer. This asset reduces the time and waste of manual processes and reduces cost. This model is a versatile and reliable tool for lapping wafers with a low cost of ownership. The machine produces consistent quality results while offering precise repeatability, accuracy, and reliability. It is suitable for a wide range of materials such as silicon, metal, and other materials.