Used SPEEDFAM / PETER WOLTERS 32 GMAW #9074534 for sale

ID: 9074534
Vintage: 1999
Lapper / Polisher Free abrasive machine Non-functional 1999 vintage.
SPEEDFAM / PETER WOLTERS 32 GMAW is an advanced grinding, lapping, and polishing equipment. It is engineered to provide a floating grinding and wet polishing method with a true diamond-bit mechanism. This ensures a highly precise finish with even micro-grain surface textures on even the hardest materials. This grinding system consists of a vacuum-sealed body with three dimensional tiltable capabilities, end-up pressure with oscillating absolute spindle adjustment, and a unique feeding unit for precise grinding. The enclosed body is able to rotate the wafer sample in all three planes simultaneously, allowing the adjustment of the grinding, lapping, and polishing stages. The X,Y, and Z components are continuously monitored for accuracy of the sample surface being processed. The end-up pressure with oscillating spindle adjustment ensures precision operation with a very limited grinding pressure. This often prevents sample damage by allowing the transfer of finishing onto the sample in a single step. The unique and proprietary feeding machine allows for a controlled stroking frequency that can be optimized for the material type and geometry being processed. SPEEDFAM 32 GMAW tool is capable of achieving sub-micron accuracies on a wide range of material along with various surface roughness ranging from 5µm to 0,1 micrometer. This offers cost savings for industries as no other post-operation surface finishing process is needed, and the grinding surface and radius quality are guaranteed. The central control asset is based on Windows software which makes the control and operation straightforward and user-friendly. The model is equipped with an online digital control equipment allowing for simultaneous adjustment of the grinding, lapping, and polishing parameters. An AC servo motor along with a feedback loop allows for unprecedented accuracy in each axis. PETER WOLTERS 32 GMAW is the ideal choice for grinding, lapping, and polishing of wafer samples. With its easy-to-operate design, high accuracy, and cost savings, this system has become a leader in the industry for wafer processing. It offers maximum efficiency and a superior finish at a fraction of the cost of other systems on the market.
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