Used SPEEDFAM SEP-310 #9366384 for sale

SPEEDFAM SEP-310 is an advanced wafer grinding, lapping & polishing equipment. It provides advanced solutions for grinding, lapping and polishing wafers of different thicknesses quickly and efficiently. The system is designed with a unique, patented, high-precision gantry unit and certified quality products to ensure consistent and repeatable results. It comes with standard diamond lapping and polishing plates for effective grinding, lapping and polishing. The machine also features automated loading and unloading for faster cycle time. The tool is designed to effectively grind, lap and polish semiconductor wafers to achieve desired surface finish and surface topography. The asset can be configured with monochromatic lasers and CCD cameras to provide high precision optical finish. It is also equipped with a high-precision 3D camera with a 5-axis positioning model to measure the flatness and topography of the wafer surface. A powerful motor is integrated into the equipment in order to achieve uniform grinding, lapping and polishing with highest accuracy. The system also features a full-size, fully enclosed environmental chamber which provides a dust-free environment for wafer grinding, lapping and polishing. The chamber is equipped with a powerful ventilator and heating and cooling systems to keep the environment at the desired temperature and humidity level. The chamber is also equipped with measuring instruments to monitor and improve the performance of the grinding, lapping and polishing processes. The unit can be operated in both wet and dry processes and is suitable for processing materials such as metals, ceramics, composites and other hard materials to achieve the desired surface finish. With its advanced technologies, the machine can achieve surface finish of less than 0.5nm Ra. The tool is also equipped with a user-friendly software for controlling and monitoring the processes. In conclusion, SEP-310 is an advanced wafer grinding, lapping & polishing asset that offers fast, reliable, and accurate results. With its advanced technologies, it is capable of grinding, lapping and polishing wafers of different thicknesses quickly and accurately. It is also easy to use and allows for repeatable results with minimal risk of human error.