Used SPEEDFAM SFDL-20B-5P #9224528 for sale

SPEEDFAM SFDL-20B-5P is a wafer grinding, lapping and polishing equipment designed for manufacturers of integrated circuits and semiconductor chips. This advanced system offers precise control, guaranteeing a superior AOI, a low cost of ownership and a fast return on investment, through its trouble-free operation. The unit utilizes a combination of either 20" or 24" diamond grinding and lapping heads, capable of achieving surface fineness down to 0.5 μm. Different sizes of diamonds are chosen depending on the intended use for the wafer. The cutting process is carefully monitored using sensors in the grinding head, which help maintain the desired surface finish and eliminate any out of specification anomalies. SFDL-20B-5P has an automated wafer loading interface which supports several wafer sizes from 300mm to 200mm. Additionally, the machine is equipped with a 5-axis positioning mechanism that allows precise micro-alignment of the wafer surface for fine grinding and lapping; this minimizes the possibility of surface damage and reduces the time required to achieve the desired level of precision. The tool also possesses advanced cooling technologies for prevention of overheating, which works in tandem with an optimized spindle design and improved wafer support structures for extra stability. During operation, the integrated onto-level port provides real-time surface evaluation of the wafers. Moreover, the dust collection asset is tailored to meet international standards for workplace safety and environmental courtesy. It is designed with high efficiency filtration model which captures and collects dust particles to aid in the prevention of air contamination. SPEEDFAM SFDL-20B-5P is a compact and user friendly equipment that can fit into restricted areas. Its features maximize the process speed and allow for repeatability. With reliability and accuracy, this system offers the highest quality wafer fabrication for the most demanding applications.