Used SPEEDFAM SFDL-9B-5L #9166348 for sale

SPEEDFAM SFDL-9B-5L is a wafer grinding, lapping, and polishing equipment which allows for the production of a wide range of advanced semiconductor devices. This mounted machine uses high-precision tools to reduce the thickness of a wafer to a pre-defined level that is custom-designed for your specific application. It carries out lapping and polishing operations with high precision and repeatability. SFDL-9B-5L wafer grinding system is ideal for applications such as interconnects, trench fabrication, VLSI, and MEMS. It uses a series of diamond wafer grinding wheels which are driven at high speeds using full servo control. This ensures that the grinding process is precise and repeatable with every pass. The grinding wheels allow for a wide range of grinding rates making it suitable for a variety of applications. The polishing process is also highly precise and repeatable. The unit has a servo-controlled platform that can handle even the most delicate materials. It also includes the latest tooling systems, ensuring the best surface quality on all processed wafers. The polishing media can be swapped out depending on the specific application, allowing for a variety of desired surface finishes. SPEEDFAM SFDL-9B-5L machine provides for precise and repeatable wafer grinding, lapping, and polishing. It offers precise and reproducible results with a wide range of applications. The tool also features full servo control, high-precision tooling, and the ability to swap out polishing media. This makes it the perfect choice for a range of applications requiring consistent and excellent surface finishes.