Used SPEEDFAM SH-24-H #176378 for sale

SPEEDFAM SH-24-H is a highly efficient wafer grinding, lapping, and polishing equipment with a single integrated production line. It is capable of simultaneously processing high-precision and large-diameter wafers up to 300 mm in diameter. The system features a self-contained robotic arm, enabling it to precisely pick up and place wafers of various sizes in between successive steps of lapping, grinding and polishing. The lapping process reduces irregularities and ensures uniformity in the surface of the wafer. A combination of an advanced multi-axis motion unit and a precision hydro-elastic press achieves excellent wafer flatness and uniform surface finish. The machine utilizes a patented, high accuracy DP-24 wheel that rotates quickly under computer control to accomplish the lapping operation. The wheel is also equipped with an integrated oscillation device for feeding up to four grit sizes. The grinding process further refines the topography of the wafer's surface. SPEEDFAM custom-designed SH-24-H grinding wheel is specifically designed for this purpose. The wheel divides the grinding process into a precision surface grinding step, followed by a quick finish grinding step. During the surface grinding step, a CNC control wheel applies a three-axis force to the wafer while a flexible grinding wheel simultaneously follows the wafer's contours. During the finish grinding step, the wheel follows the same motion path, but in a higher resolution and with a much higher feed rate. The polishing process further refines the shape and texture of the wafer's surface. SPEEDFAM SH-24-H employs two distinct polishing techniques. First, it utilizes a fully automated, zero-clearance inspection station that measures the global form accuracy of the wafer and eliminates any microscopic burrs. Next, a multi-axis robotic arm applies a precise polishing force onto the entire wafer surface. The wafer is then oriented and recessed in one of the four proprietary polished plates, onto which an optically transparent polishing pad is secured. This pad contains precisely graded mechanical polishing media that is used in conjunction with specially formulated polishing compounds for consistent and controlled results. Overall, SH-24-H tool is a highly versatile, high-performance wafer grinding, lapping, and polishing asset that quickly and easily meets the most stringent production requirements. With its advanced technology, the model ensures high accuracy and guarantees the highest quality of wafer finishing.