Used SPEEDFAM SH-24 #9255915 for sale

SPEEDFAM SH-24
ID: 9255915
Vintage: 1996
Single head polisher, 24" Plate diameter Rough polishing: 609.6 mm Final polishing: 656.0 mm Pressure plate diameter: 228.6 mm Polishing plate rotation speed: 6 - 36 rpm Pressure plate drive speed: 6-36 rpm Oscillation width: 520 mm maximum Oscillation speed: 5 - 30 mm/sec Pressure plate FWD/BWD stroke: 70 mm Pressure cylinder: 100 x 120 st Electrical / Air specifications: Main motor: 2.5 kW, 4 P Oscillation motor: 0.9 kW Pressure plate drive motor: 0.2 kW, 4 P Air pressure: 4.5 - 5.0 kg/cm² Air supply: 22 N1/hr Control circuit: 100 V, 1 Phase, 50/60 Hz Main power: 200 V, 3 Phase, 50/60 Hz Total: 2.52 kW 1996 vintage.
SPEEDFAM SH-24 is a precision wafer grinding, lapping, and polishing equipment that enables high-yield, cost-efficient mass production of ultrahigh precision wafers. It is designed and manufactured with the latest technological advances to provide state-of-the-art performance and efficiency. SH-24 features an innovative spindle feed system that is capable of indexing from 1.0 µm up to 160 µm per revolution. This ensures precise and repeatable lapping and grinding results to ensure optimal surface finish and flatness. The integrated dual-stage servo motor ensures high spindle speed stability, allowing for the lapping and polishing of a wide variety of materials. SPEEDFAM SH-24 also features an advanced lapping plate loader, which enables quick loading and unloading of multiple lapping plates for instant wafer preparation. This greatly increases throughput and production efficiency. Additionally, the integrated wet scrubber ensures uniform and consistent liquid delivery, eliminating the need for manual wiping and cleaning. Moreover, SH-24 is fitted with an optional vision unit that monitors the wafer processing stage and automatically adjusts the pressure and speed to ensure optimal results. This ensures uniform surface finish and flatness even on difficult-to-process materials. An optional automatic substrate pre-cooling machine further enhances the performance of SPEEDFAM SH-24. This prevents potential thermal damage on delicate substrates and minimizes total warpage. Furthermore, the cooling tool also provides excellent process control and uniformity. Overall, SH-24 is a versatile, cost-effective, and reliable wafer grinding, lapping, and polishing asset that is designed for high-yield, consistent, and precise production of ultrahigh precision wafers. With its advanced features, SPEEDFAM SH-24 provides accurate and repeatable results, while ensuring high throughput, reduced cost of operation, and improved overall productivity.
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