Used SPEEDFAM SNG-32BAW #9279646 for sale

SPEEDFAM SNG-32BAW is a fully automated wafer grinding, lapping and polishing equipment. It is designed to process 6, 8, 12, and 16 inch diameter wafers with a maximum capacity of 16 inches. It features a liquid cooled spindle for reduced thermal drift and improved accuracy, as well as a three-stage spindle speed control system. The device is also designed to provide precise control of the grinding, lapping, and polishing process, minimizing process variation and improving product yields. SNG-32BAW features include a PLC controller with a multi-zone environmental enclosure to maintain temperature stability. The machine is also equipped with two separate headstocks that can be configured to grind either one or two wafers simultaneously, and has a high-precision chuck unit for precise, low micro-cut grinding accuracy. The machine also contains a high-pressure lubrication machine, for consistent grinding pressure. The lapping process is completed by the internal planetary gear tool mounted on the headstock. The machine features a high-accuracy rotary motion drive asset for displacement accuracy of ±0.3 μm. It also offers a three-zone variable speed rotary motion control model for lapping speed adjustment and the ability to quickly switch between 6, 8, 12, and 16 inch diameter wafers. SPEEDFAM SNG-32BAW offers a range of polishing options with its multi-zone planetary variable speed control equipment and simple programming algorithm. With the help of a touch screen controller, it is possible to program a step-by-step polishing sequence that helps to ensure uniform polishing results. Additionally, the inner and outer polishing tools can be configured with different polishing speeds and settings. SNG-32BAW also features a large data acquisition system and data analysis unit that can be used to track, analyze, and optimize process performance. The machine can also be connected to an optional computer-based graphics-processing unit (GPU) for advanced data analysis and monitoring of the wafer grinding, lapping and polishing processes. All in all, SPEEDFAM SNG-32BAW is a highly versatile and reliable wafer grinding, lapping and polishing machine that is designed to deliver precise results with minimal process variation. The inclusion of a robust PLC controller, variable speed control tool, and the data acquisition and analysis asset make this an ideal solution for those looking for a robust and accurate wafer grinding, lapping, and polishing device.