Used SPEEDFAM SNG 32BTW #9193194 for sale

SPEEDFAM SNG 32BTW is a grinding, lapping, and polishing equipment for producing high quality wafers in various sizes. It is designed to rapidly reduce the surface roughness and profile accuracy of thin wafers while maintaining superior uniformity over the entire wafer. The system utilizes a rotary grinding head mounted on an X-Y table, providing a controlled grinding speed and precise movement. SNG 32BTW is capable of grinding both sides of a wafer simultaneously, with adjustable feed rates from 1 to 40 microns per stroke. The unique feature of SPEEDFAM SNG 32BTW is its 3-axis automated control unit for precise and precise surface preparation. The machine includes a spindle load monitoring tool for ease of setup and adjusting spindle speed. The asset also offers one of the most accurate and repeatable feed rate precision available in the market. SNG 32BTW also offers an optional auto-compensating capability for better performance. The model has a unique tooling equipment which allows simple and quick exchange of wafer grinding tools and polishing consumables. The exchange feature ensures high grinding accuracy and uniformity over the entire wafer. The system also includes an optional integrated vision unit, allowing automated alignment of the wafer to allow for precise surface preparation. SPEEDFAM SNG 32BTW also offers an optional touch screen control for ease of operation. SNG 32BTW utilizes a 20-station process wheel for bulk processing, allowing 12 grinding and 8 polishing operations. This provides a flexible and cost effective solution for surface preparation. The machine also utilizes an automatic sliding chair for loading and unloading the wafer, providing high efficiency and throughput. Overall, SPEEDFAM SNG 32BTW is an ideal tool for grinding, lapping, and polishing wafers with increased throughput, flexibility, and accuracy. By utilizing the automatic control asset and integrated vision model, the equipment ensures high accuracy and repeatability. Furthermore, the exchangeable tooling system and integrated process wheel provide cost and time savings while maintaining superior uniformity. SNG 32BTW is the perfect solution for any wafer manufacturing application.