Used SPEEDFAM SNG-32SPAW #9203850 for sale

SPEEDFAM SNG-32SPAW is a high-powered wafer grinding, lapping, and polishing equipment designed to quickly process large batches of wafers. This versatile system is ideal for producing uniform, high- quality results for both single and multi-layer wafers up to 8" (200mm) in diameter. SNG-32SPAW offers a fully automated process, beginning with a wafer chuck, followed by a series of precision grinding, polishing, and lapping operations. The polishing table is designed to provide low-stress, high-precision grinding and polishing, utilizing a constant force control unit to and a real-time particle impact measurement machine in order to maintain the desired thickness of the wafer. The grinding, lapping, and polishing of the wafer is achieved with a series of diamond slurries and diamond compounds, specifically formulated for each application used by the machine. By adjusting the RPM, pressure, and selective liquid distribution rate, the tool is capable of grinding, lapping, and polishing multiple wafers simultaneously with precision accuracies. Additionally, the abrasive particles used in the process are constantly monitored and changed in order to maintain optimal results. SPEEDFAM SNG-32SPAW also features a high-speed cleaning chamber, which removes all particles from the processed wafer and utilizes a combination of air-vacuum and deionized water to flush away any remaining debris and residue. After cleaning, the wafer is manually inspected and then transferred to a dedicated storage and inspection area. This machine is extremely reliable and cost effective, with virtually no downtime and minimal maintenance requirements. SNG-32SPAW is user-friendly, providing operators with simple instructions and fast operation to maximize production of quality wafers. As a result, SPEEDFAM SNG-32SPAW is an efficient and reliable choice for cost-effective manufacturing of wafers.