Used SPEEDFAM SNQ-32BTAW #9203851 for sale

SPEEDFAM SNQ-32BTAW is a comprehensive wafer grinding, lapping and polishing equipment designed for advanced processes. The system is equipped with a range of sophisticated features including high precision grinding, lapping and polishing processes, capable of creating precise and uniform surfaces on semiconductor wafers, solar photovoltaic (PV) modules, and glass substrates with repeatable results. The machine is based on a three-loading modular structure, which includes a multi-axis grinding head, a free-angle lapping table, and a single-axis polishing head. The grinding head is structured to travel along five-axis paths, incorporating variable speed servo-motor controlled linear feeds. This gives the machine versatility in the range and number of grinding processes that can be carried out. The lapping table runs for a defined time along two circular arcs, and is designed to be easily adjustable so the user can select the required lapping speed, angle and direction of each lapping stroke. The table also incorporates a variable-speed, servo-motor-controlled lapping arm and spindle to ensure repeatable and consistent lapping performance. The last stage of the unit is the single-axis polishing head, that is structured to rotate along a vertical axis at a variable speed, with up to six-degrees of freedom in the X, Y and Z directions. This gives the operator precise control over the polishing process, allowing them to accurately alter the working surface parameters for each application. The machine is encloses in an air conditioned dust-proof enclosure, with a robust construction for industrial applications. Additionally, SNQ-32BTAW is equipped with intelligent control features including sensors to monitor parameters such as temperature and force applied, which enable increased accuracy and process optimization. Overall, SPEEDFAM SNQ-32BTAW is a powerful and efficient tool for grinding, lapping and polishing in production lines and research environments. Its sophisticated structure, intelligent control features and modular design helps to ensure repeatable and accurate results with precise surface parameters and high throughput.